Please use this identifier to cite or link to this item: http://192.168.98.239:8080/jspui/handle/1994/1422
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dc.date.accessioned2019-07-01T08:51:22Z-
dc.date.available2019-07-01T08:51:22Z-
dc.date.issued2008-12-09-
dc.identifier.urihttp://192.168.98.239:8080/jspui/handle/1994/1422-
dc.descriptionProject Worken_US
dc.description.abstractNot Availableen_US
dc.format.extent23p.en_US
dc.language.isoenen_US
dc.publisherTezpur Universityen_US
dc.subjectPhysicsen_US
dc.subjectNanoparticlesen_US
dc.subjectCopper compoundsen_US
dc.subjectSilver compoundsen_US
dc.subjectThin filmsen_US
dc.titleA study on dependence of Nano sized grains on thickness in thermally deposited copper thin films and a comparative study with silver thin filmsen_US
dc.typeOtheren_US
dc.contributor.guideDas, H. L.-
dc.creator.researcherSha, Narang B.-
dc.departmentDepartment of Physicsen_US
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03_contents_tables_figures_1880.pdfList of Contents, Tables and Figures72.26 kBAdobe PDFThumbnail
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