Brown,William <br/><br/>
Advanced electronic packaging: with emphasis on multichip modules / 
Brown,William. 
 - New York:  IEEE press,  1998. 
 - xxxii,789p;28cm 
<br/><br/>Includes bibliographical references. 
<br/><br/><label>ISBN: </label>0780347005 
<br/><br/><label>Dewey Class. No.: </label>621.38 BRO